HS-BGA IC softens and removes resinating and sealing glue of chip BGA IC of mobile phones. The ingredients of it is newestly, environmental protection and safest. It has good permeability; it can quickly soften and loosens solidified resin adhesive such as phonetics, epoxy, acrylate, polyurethane, organosilicon. It does not do harm to circuit board and component.


Attention: With BGA IC adhesive Removing Liquid, it shall not touch eyes and skin. If it is touched by accident, use a lot of clean water to wash. When finished, it should be sealed with a cap to avoid volatilizing which will make the effect not good. Be careful to open it since there is pressure.
 
This item can not be shipped by DHL, only Hong Kong post or EMS can.