Fuji SMT patch red plastic FUJI Seal-glo SMT adhesive is applied to the area of the composition of a stable single-epoxy, for all types of SMD components can obtain a stable bond strength. Its high-speed coating and low temperature curing properties have been SONY, EPSON, AIWA, NEC, SHARP, SANYO, OMRON, TOSHIBA, MITSUBISHI, NAMTAI, LENOVO, SEIKO, OLYMPUS, such as long-term use at home and abroad enterprises.

Features: 
 ? allow the low temperature curing;
 ? While high-speed coating, micro small amount of coating can be maintained without any drawing, the shape stability of collapse;
 ? adhesive parts for a variety of shows that are available to the stability of the adhesive strength;
 ? storage stability and excellent performance;
 ? with high heat resistance and excellent electrical properties;
 ? also be used for printing.

Curing conditions:
8800T: recommended curing temperature of the substrate surface condition is 150 ? after 45 seconds, after 100 seconds to reach 120 ?;
* the higher the curing temperature and curing time, the longer the height of the intensity of the more available;
* part by containing the size of the substrate, and filled with different positions, the actual adhesive attached to the temperature change, so need to find the most suitable curing conditions.
 Use
* In order to maximize the characteristics of adhesive effect, be sure to place the refrigerator (2 ? ~ 10 ?) preserved;
* removed from the refrigerator to use when the temperature until the adhesive fully restored to room temperature before use;
* If the hose at the point of dispensing by adding the amount of the plunger can be made more stable;
* drawing for the relationship to prevent the most appropriate dispensing temperature is set 30 ? ~ 38 ?;
* filling the hose from the cylinder, please use our private automatic filling machines, in order to prevent infiltration of air bubbles;
* For a point of washing hose using DBE or ethyl acetate.

Note: The paste cannot be shipped by DHL, have to ship by EMS or air mail.